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Centerless Grinding Wheel For Semiconductor And Photoelectricity Industries

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Xinzheng Dia Abrasives Co.,Ltd

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Centerless Grinding Wheel For Semiconductor And Photoelectricity Industries

MOQ : 1PC

Price : Negotiable

Payment Terms : T/T

Supply Ability : 20000 pcs per month capacity

Delivery Time : 10-14 days delivery time

Packaging Details : Box

Place of Origin : China

Certification : High QC standard, 100% inspection

Bonding Agent : Resin

Common Shape : 1A1

Type : Cutting Tool

Feature : High efficiency

Key word : Centerless Wheels

Grit size : Resin bond the finest grit size is 3000

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Centerless Wheels

Centerless grinding is a machining process that uses abrasive cutting to remove material from a workpiece. Centerless grinding differs from centered grinding operations in that no spindle or fixture is used to locate and secure the workpiece; the workpiece is secured between two rotary grinding wheels, and the speed of their rotation relative to each other determines the rate at which material is removed from the workpiece.

Features:

Resin:
High efficiency grinding in one batch, good sharpness, long using life
Vitrified:
high efficiency and good shape retention

Specification:

Common Shape	Wheel Size	Grit Size	Classic Specification
1A1	Resin Maximum OD is 750mm Vitrified OD:300mm~500mm	Resin the finest grit size is 3000

Application

Industry	Workpiece&Material	Machine	Bond	Working Data
Semiconductor and Photovoltaic industries	Ceramic, magnet, sapphire		Resin Vitrified

Product Tags:

pcd cutting tool blanks

diamond bruting wheel

Quality Centerless Grinding Wheel For Semiconductor And Photoelectricity Industries for sale

Centerless Grinding Wheel For Semiconductor And Photoelectricity Industries Images

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